22F Specification of Copper Clad Laminates, Printed Circuit Board, PCB, Electronic

Importer and Exporter of Paper Based and Epoxy Based
Copper Clad Laminates used for Printed Circuit Boards.

Products

COPPER CLAD LAMINATE
22F SPECIFICATION

NO	ITEM	UNIT	CONDITION AND METHOD	INDEX
1	SOLDERABILITY 260⁰C	S	A	MIN:10
2	PEEL STRENGTH AT NORMAL CONDITION AFTER 5S HEAT STOCK	N/MM	S-5S/260OC	MIN:1.2
3	VOLUME RESISTIVITY AT NORMAL CONDITION: AFTER RECOVERY THROUGH STEADY HEAT/HUMIDITY TREATMENT:	M W.M	C-96/20/65+C-96/ 40/90/E-2/100	MIN:2.0*103 100
4	SURFACE RESISTANCE:	M W	C-96/20/65_C-96/ 40/90/E-2/100	MIN:2.0103 1.0103
5	(1MHZ)PERMITIVITY AT NORMAL CONDITION: AFTER IMMERSDING IN WATER:	-	C-96/20/65+C-96/	MAX:5.0
6	(1MHZ)DIELECTRIC DISSIPATION FACTOR	-	C-96/20/65+C-96/	MAX:0.05
7	FLEXURAL STRENGTH	MPA	A	MIN:110
8	PULL-OFF STRENGTH	N	A	MIN:60
9	FLAMMABILITY	-	A	FVO/FV1
10	WATER ABSORPTION	MG	E-24/50+D-24/23	MAX:40