1

peel stRength
at normal condition:
after 5s heat shock

n/mm

min: 1.0

2

blistering test
after 10s heat shock

min: 1.0
no obvious blister or delamination

3

punching property

cold-punching

4

heatproof
after 60min at 130+/-2⁰Cair

no obvious blister no copper foil peel

5

copper foil resistance

m W

max: 3.5

6

volume resistivity
at normal condition:
after recovery through steady heat/humidity treatment:

m W

min: 5.0x10⁵
min: 5.0x10⁴

7

surface resistance
at normal condition:

after recovery through steady heat/humuNIdity treatment:

on etching copper foil side

min:
1.0x10⁴
min: 1.0x10³

8

insulating resistance
at normal condition:
after boiling in wAter:

min: 5.0x10⁴
min: 1.0x10

9

dielectric dissipation factor
at normal condition:  
after immersing in water:

max: 0.01
max: 0.05

10

permitivity
at normal condition:
after immersing in water:

max: 5.5
max: 6.0

11

laminates properties etched copper foil

mpa

12

flexural strength
trichloroethylen and alkali resistance

min: 100
appearance no obvious variety

13

falling ball impact

cm

min: 5

14

water absorption

%

max: 1.8